Dropping or roughly handling panels during transport between assembly stations can flex the substrates. Core Methodologies of IPC-9704
In the world of printed circuit board assembly (PCBA), mechanical stress is the silent killer. You can have perfect solder paste deposition, a flawless reflow profile, and immaculate cleanliness, but if your board flexes too much during assembly or test, you will crack ceramic capacitors and rip copper pads. ipc-9704 pdf
This measures how fast the board is bending. Solder resists slow bending much better than sudden, violent impacts. A high strain rate drops the allowable strain threshold significantly. Diagonal Strain Dropping or roughly handling panels during transport between
Connect the strain gauges to a high-speed data acquisition (DAQ) system capable of sampling at rates up to 50 kHz (crucial for capturing transient shock events like depanelization). This measures how fast the board is bending
12 to 16-bit input resolution to ensure precision. 4. Data Analysis and Reporting
While IPC-9701 sets the standards for reliability testing, IPC-9704 offers specific guidance on how to execute these tests to predict the life of the assembly.